2021 The 6th International Conference on Mechanical and Electronics Engineering (icmee 2021)


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Osaka International Convention Center, Osaka, Japan

5 Chome-3-51 Nakanoshima, Kita Ward, Osaka, Japan Karte

Accepted papers can be published in ICMEE IOP proceedings and indexed by EI Compendex, Scopus, etc

The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6
The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6
The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31

Submission Method
1. Send your manuscript directly to conference official email: icmee@outlook.com
2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2021

Conference Scope
The works that will be presented and published at conference will focus on, but are not limited to, the following topics:

Mechanical Engineering
Acoustics and Noise Control Marine System Design
Aerodynamics Material Engineering
Applied Mechanics Material Science and Processing
Automation, Mechatronics and Robotics Mechanical Design
Automobiles Mechanical Power Engineering
Automotive Engineering Mechatronics
Ballistics MEMS and Nano Technology
Biomechanics Multibody Dynamics
Biomedical Engineering Nanomaterial Engineering
CAD/CAM/CIM New and Renewable Energy
CFD Noise and Vibration
Composite and Smart Materials Noise Control
Compressible Flows Non-destructive Evaluation
Computational Mechanics Nonlinear Dynamics
Computational Techniques Oil and Gas Exploration
Dynamics and Vibration Operations Management
Energy Engineering and Management PC guided design and manufacture
Engineering Materials Plasticity Mechanics

Ms. Serene Lo

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