The 3rd International Conference on Industrial Applications of Big Data and Artificial Intelligence

Asistiré:

sep
23

Wuhan, China Mapa

Call for Paper
The 3rd International Conference on Industrial Applications of Big Data and Artificial Intelligence (BDAI 2021)
Sept. 23-25, 2021 |Wuhan, China
http://bdai2021.org/

The 3rd International Conference on Industrial Applications of Big Data and Artificial Intelligence (BDAI 2021) will be held in Wuhan, China during Sept. 23-25, 2021, which is organized by China University Of Geosciences(Wuhan), sponsored by Hong Kong Society of Mechanical Engineers(HKSME). We warmly welcome prospective authors to submit your research papers to BDAI, and share your latest research results and valuable experiences with other top-scientists, engineers and scholars from all over the world.

●Publication and Indexing
All the registered and presented papers will be published in Journal of Physics: Conference Series, which will be submitted to Engineering Village, Scopus, Thomson Reuters (WoS) and other indexing organizations for review and indexing.
BDAI 2020 conference proceedings has been indexed by EI & SCOPUS.

●Speakers(Continuous update)
Prof. Dan Zhang,York University, Canada
Assoc. Prof. Simon James Fong, University of Macau, Macau S.A.R., China

●Topics of interest for submission include, but are not limited to:
AI
Machine Learning
Big Data
Data Science
Industry 4.0 & Robotics
More topics can be found at: http://bdai2021.org/cfp.html

●Paper Submission
1. You can choose to submit your paper directly to bdai_conference@vip.163.com
2. You can submit your full paper through electronic submission system:
https://cmt3.research.microsoft.com/BDAI2021

●Contact Us:
If you have any question, please feel free to contact our conference secretary.
Ms. Monie Wang
Tel: +852-30506862/+86-18200296850
Email: bdai_conference@vip.163.com
website: http://bdai2021.org/

HK SME
Organizador:
 HK SME