2021 The 6th International Conference on Integrated Circuits and Microsystems (icicm 2021)

Publication: Conference Proceeding
Indexed by: Ei Compendex, and Scopus, etc.
Submission email: icicm@young.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)
Find the tempalte with the link: http://icicm.net/files/Template.doc

Co-sponsored by
University of Electronic Science and Technology of China, China
Technology of China and Southeast University, China

Topics
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS

Conference Contact
Ms Zeng
Email: icicm@young.ac.cn
Tel: +86-28-87777577
Web: www.icicm.net